Destructive & Non-Destructive Testing

Destructive & Non-Destructive Testing Process:

Destructive testing alters or damages the material being tested to gather information, while non-destructive testing (NDT) examines materials without causing harm, allowing for continued use. 
Here’s a more detailed explanation:

Destructive Testing:

• Tensile Testing:
  Measures the force required to break a material under tension, providing information about tensile strength, yield strength, and ductility.
• Compressive Testing:
  Measures the force required to crush a material under compression, providing information about compressive strength.
• Bending Testing:
  Measures the force required to bend a material until it fractures, providing information about ductility and bending strength.
• Hardness Testing:
  Measures a material’s resistance to indentation or scratching, providing insights into its wear resistance and machinability.
• Fatigue Testing:
  Measures a material’s ability to withstand repeated loading and unloading cycles, providing information about its fatigue life.
• Impact Testing:
  Measures a material’s ability to absorb energy under sudden impact, providing information about its toughness.
• Residual Stress Testing:
  Measures the stresses that remain in a material even after it has been deformed or processed, which can affect its overall performance.
• Bend Test:
  Bends a straight plate specimen through 180° around a former to check for cracks.

Non-Destructive Testing (NDT):

• Purpose:
  To inspect materials and identify defects or flaws without altering or damaging them.

Examples:

• Ultrasonic Testing (UT):
  Uses high-frequency sound waves to detect internal flaws and assess material thickness.
• Radiographic Testing (RT):
  Uses X-rays to reveal internal defects, similar to medical X-rays.
• Magnetic Particle Testing (MT):
  Detects surface and near-surface flaws in ferromagnetic materials by using magnetic fields and particles.
• Liquid Penetrant Testing (PT):
  Uses a dye to reveal surface cracks or pores by capillary action.
• Eddy Current Testing (ET):
  Uses electromagnetic induction to detect flaws in conductive materials.
• Visual Testing (VT):
  Involves visual inspection for surface defects.